Chemical Vapor Deposition (CVD)
Technical Data | Chemical Vapor Deposition (CVD) |
| Company: | Sentech |
| Model: | SI 500 D PE-Deposition |
| Application: | Thin-film deposition, Encapsulation, Coating |
| Process type: | Plasma deposition CVD |
| Material: | SiO2, SiNx, SiONx, and a-Si films |
| Substrate type: | Wafers up to 200 mm diameter parts loaded on carriers |
| Substrate temperature range: | Room temperature up to 350 °C |
| Plasma option: | Type: Planar Triple Spiral Antenna (PTSA) ICP plasma source |
| Control system: | PLC control with PC user interface |
| Integration: | Glove box Load-lock |